Henkel Technomelt PA 657 Black Encapsulation Hot Melt
Henkel Technomelt PA 657 Black Encapsulation Hot Melt Overview
Henkel Technomelt PA 657 is a high-performance thermoplastic polyamide designed to meet low-pressure molding process requirements. This product can be processed at a low processing pressure due to its low viscosity, allowing the encapsulation of fragile components without damage. This material produces no toxic fumes and provides a good balance of low and high-temperature performance.
Features and Benefits
- Easy moldability
- Good adhesion to a variety of substrates
- Cold temperature flexibility
- Excellent moisture resistance
Specifications
- Series: Technomelt PA 657 Black
- Type: Hot Melt Adhesive
- Application: Molding
- Chemistry: Polyamide
- Components: One-Component
- Cure: Physical Setting
- Appearance: Black
- Molding Temperature: 356°F to 446°F (180°C to 230°C)
- Operating Temperature Range: -40°F to 212°F (-40°C to 100°C)
- Softening Point: 302°F to 329°F (150°C to 165°C)
- Melting Viscosity:
- Approx. 8,600 cps @ 356°F (180°C)
- Approx. 6,500 cps @ 374°F (190°C)
- Approx. 4,900 cps @ 392°F (200°C)
- Approx. 3,000 cps to 4,500 cps @ 410°F (210°C)
- Specific Gravity @ 68°F (20°C): 0.98 g/cm³
- Shore A Hardness: 77
- Yield Strength: 375 psi (2.6 N/mm²)
- Break Strength: 390 psi (2.7 N/mm²)
- Elongation: 350%
- Temperature Creep Resistance: 257°F (125°C)
- Low Temperature Flexibility: -58°F (-50°C)
- Water Absorption (1 Day) 1.4% @ (23°C)
- Glass Transition Temperature (Tg) -49°F (-45°C)
